AM29LV400BB50REC datasheet

Маркировка

AM29LV400BB50REC
Производитель

AMD (Advanced Micro Devices)
Описание

AMD (Advanced Micro Devices) AM29LV400BB50REC Mfr Package Description: TSOP-48 Technology: CMOS Package Shape: RECTANGULAR Package Style: SMALL OUTLINE, THIN PROFILE Surface Mount: Yes Terminal Form: GULL WING Terminal Pitch: 0.5000 mm Terminal Position: DUAL Number of Functions: 1 Number of Terminals: 48 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 8 Organization: 512K X 8 Memory Density: 4.19E6 deg Operating Mode: ASYNCHRONOUS Number of Words: 524288 words Number of Words Code: 512K Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 3 V Supply Voltage-Nom (Vsup): 3 V Memory IC Type: FLASH 3V PROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 50 ns
Количество страниц

27 шт.
Формат

PDF
(Для просмотра требуется Adobe Acrobat Reader)
Размер файла

671,59 KB